JTEKT TOYODA
JTEKT DXSG320
Wafer Grinder/Lapping Machine
Grinding Capacity/Lapping capacity: Ø200 – Ø300mm
Description: Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.
Grinding Capacity/Lapping capacity: Ø200 – Ø300mm
Description: Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.
